Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration

✍ Scribed by K. N. Chen; C. S. Tan; A. Fan; R. Reif

• Book ID: 107453421
• Publisher: Springer US
• Year: 2005
• Tongue: English
• Weight: 89 KB
• Volume: 34
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-005-0151-0