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Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications

✍ Scribed by S. K. Datta; S. N. Tewari; J. E. Gatica; W. Shih; L. Bentsen

Book ID: 107449852
Publisher: The Minerals, Metals & Materials Society
Year: 1999
Tongue: English
Weight: 731 KB
Volume: 30
Category: Article
ISSN: 1073-5623
DOI: 10.1007/s11661-999-0205-7

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