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Contractive stress of epoxy resin during isothermal curing

✍ Scribed by Takashi Igarashi; Shingo Kondo; Mikio Kurokawa


Publisher
Elsevier Science
Year
1979
Tongue
English
Weight
368 KB
Volume
20
Category
Article
ISSN
0032-3861

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Water absorption isotherms for cured bis
✍ Bryan Ellis; H. U. Rashid πŸ“‚ Article πŸ“… 1984 πŸ› John Wiley and Sons 🌐 English βš– 868 KB

Water-sorption isotherms have been determined for some bisphenol-A-type epoxy resins cured with either 4,4'-diamino diphenyl methane (DDM), phthalic anhydride, or polyamide, Versamid 115. The absorption isotherms for the diamine-cured resin are reversible and that at 0.2"C is linear for the whole ac