✦ LIBER ✦
Contraction stress build-up of anisotropic conductive films (ACFs) for flip-chip interconnection: Effect of thermal and mechanical properties of ACFs
✍ Scribed by Woon-Seong Kwon; Kyung-Wook Paik
- Publisher
- John Wiley and Sons
- Year
- 2004
- Tongue
- English
- Weight
- 255 KB
- Volume
- 93
- Category
- Article
- ISSN
- 0021-8995
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