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Connecting difficult-to-join pipes

Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
135 KB
Volume
2003
Category
Article
ISSN
1350-4789

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โœฆ Synopsis

Applicant: Epcos AG, Germany

This invention relates to a method for hermetically encapsulating an electronic component that is mounted in flip-chip design on a support. The method described is characterized by first covering the component with a film, which closely rests on the component and the support, then structuring the film, and providing a hermetic sealing layer, especially a metal layer, which creates a seal with the support.

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