✦ LIBER ✦
Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates
✍ Scribed by Koushik Ramachandran, Fuhan Liu, P. Markondeya Raj, Venky Sundaram, Rao Tummala
- Book ID
- 118816471
- Publisher
- Springer US
- Year
- 2012
- Tongue
- English
- Weight
- 666 KB
- Volume
- 42
- Category
- Article
- ISSN
- 0361-5235
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