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Conduction cooling for an LSI package: a one-dimensional approach : R. C. Chu, U. P. Hwang and R. E. Simons. IBM Jl Res. Dev.26 (1), 45 (1982)


Publisher
Elsevier Science
Year
1983
Tongue
English
Weight
251 KB
Volume
23
Category
Article
ISSN
0026-2714

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