Computer simulation of process induced stress and strain development during cure of thick-section thermosetting composites

✍ Scribed by Sh. Teplinsky; E.M. Gutman

• Book ID: 116161524
• Publisher: Elsevier Science
• Year: 1996
• Tongue: English
• Weight: 446 KB
• Volume: 6
• Category: Article
• ISSN: 0927-0256
• DOI: 10.1016/0927-0256(96)00035-3