✦ LIBER ✦
Computational modelling for reliable flip-chip packaging at sub-100 μm pitch using isotropic conductive adhesives
✍ Scribed by S. Stoyanov; R. Kay; C. Bailey; M. Desmulliez
- Book ID
- 104057896
- Publisher
- Elsevier Science
- Year
- 2007
- Tongue
- English
- Weight
- 622 KB
- Volume
- 47
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.