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Compressive behavior of an electrodeposited nanostructured copper at quasistatic and high strain rates

✍ Scribed by D Jia; K.T Ramesh; E Ma; L Lu; K Lu


Book ID
114386715
Publisher
Elsevier Science
Year
2001
Tongue
English
Weight
614 KB
Volume
45
Category
Article
ISSN
1359-6462

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