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Composite part design based on numerical simulation of the manufacturing process

✍ Scribed by Serge Mouton; Yann Ledoux; Denis Teissandier; Patrick Sébastian

Book ID
105854141
Publisher
Springer
Year
2010
Tongue
English
Weight
451 KB
Volume
55
Category
Article
ISSN
0268-3768

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## Abstract Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the substrate. For better mould design and optimization of the proce