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Compliance tensor for an elastic material reinforced in two directions

โœ Scribed by D. S. Abolin'sh


Publisher
Springer US
Year
1969
Tongue
English
Weight
430 KB
Volume
2
Category
Article
ISSN
1573-8922

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An alternative model for elastic thermal
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The elastic stress distribution resulting from thermal mismatch in a film/graded layer/substrate system is a critical issue. Recently by a three-variable method Hsueh and Lee formulated a closed-form analytical solution [Hsueh CH, Lee S. Modeling of elastic thermal stresses in two materials joined b