Comparison of the properties of AlGaInN light-emitting diode chips of vertical and flip-chip design using silicon as the a submount

✍ Scribed by Markov, L. K.; Smirnova, I. P.; Pavlyuchenko, A. S.; Kukushkin, M. V.; Vasil’eva, E. D.; Chernyakov, A. E.; Usikov, A. S.

• Book ID: 120073342
• Publisher: Springer
• Year: 2013
• Tongue: English
• Weight: 189 KB
• Volume: 47
• Category: Article
• ISSN: 1063-7826
• DOI: 10.1134/S1063782613030160