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Comparison of silicone and spin-on glass packaging materials for light-emitting diode encapsulation

✍ Scribed by Chang, Liann-Be; Pan, Ke-Wei; Yen, Chia-Yi; Jeng, Ming-Jer; Wu, Chun-Te; Hu, Sung-Cheng; Kuo, Yang-Kuao

No coin nor oath required. For personal study only.

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