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Comparison of RF integrated passive devices on smart silicon and glass substrate

✍ Scribed by Inho Jeong; J. Y. Kim; B. J. Lee; J. J. Choi; Y. S. Kwon


Publisher
John Wiley and Sons
Year
2005
Tongue
English
Weight
768 KB
Volume
45
Category
Article
ISSN
0895-2477

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High performance RF integrated passive d
✍ Inho Jeong; Ki-Joong Kim; Tong-Ook Kong; Jun-Seok Kim; Hyung-Kyu Choi; Choong-Mo πŸ“‚ Article πŸ“… 2003 πŸ› John Wiley and Sons 🌐 English βš– 309 KB

## Abstract In this paper, we develop a low‐cost manufacturing technology for RF substrate and a high‐performance process technology for integrated passive devices by electrochemically forming thick oxide on Si wafer and processing Cu thick metal and BCB. Several integrated passive devices such as