High performance RF integrated passive d
β
Inho Jeong; Ki-Joong Kim; Tong-Ook Kong; Jun-Seok Kim; Hyung-Kyu Choi; Choong-Mo
π
Article
π
2003
π
John Wiley and Sons
π
English
β 309 KB
## Abstract In this paper, we develop a lowβcost manufacturing technology for RF substrate and a highβperformance process technology for integrated passive devices by electrochemically forming thick oxide on Si wafer and processing Cu thick metal and BCB. Several integrated passive devices such as