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Comparison of bonding procedures for 3D-structured polyimide films on silicon substrates applied to ink-jet cartridges

✍ Scribed by T. Goettsche; C. Ruddy; U. Heller; M. Stehr; H. Ashauer; T. Lindemann; P. Koltay; Y. Yu; R.-P. Peters; P. Soriani; A. Bellone


Book ID
105851956
Publisher
Springer
Year
2006
Tongue
English
Weight
405 KB
Volume
33
Category
Article
ISSN
0268-3768

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