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Comparison between different models for the thin metallic substrate in multilayer microstrip structures

✍ Scribed by Lu Zhang; Jiming Song


Publisher
John Wiley and Sons
Year
2006
Tongue
English
Weight
313 KB
Volume
48
Category
Article
ISSN
0895-2477

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✦ Synopsis


Abstract

The dispersive characteristics of multilayer microstrip structures with one thin metallic substrate are studied using the spectral‐domain approach. The numerical results of several approximate models are compared with that of the immittance approach as one exact model. The comparison shows that the widely used resistive sheet (R‐card) model is not appropriate to handle such structures over a broad frequency range. Β© 2006 Wiley Periodicals, Inc. Microwave Opt Technol Lett 48: 1113–1117, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21556


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