✦ LIBER ✦
Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test
✍ Scribed by Hongbin Shi; Toshitsugu Ueda
- Book ID
- 113800551
- Publisher
- Elsevier Science
- Year
- 2011
- Tongue
- English
- Weight
- 927 KB
- Volume
- 51
- Category
- Article
- ISSN
- 0026-2714
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