✦ LIBER ✦
Comparative evaluation of thermal interface materials for improving the thermal contact between an operating computer microprocessor and its heat sink
✍ Scribed by Timothy A. Howe; Chia-Ken Leong; D. D. L. Chung
- Publisher
- Springer US
- Year
- 2006
- Tongue
- English
- Weight
- 240 KB
- Volume
- 35
- Category
- Article
- ISSN
- 0361-5235
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