Combining a morphological interpolation approach with a surface reconstruction method for the 3-D representation of tomographic data

A dual BIE approach for large-scale mode

A dual BIE approach for large-scale modelling of 3-D electrostatic problems with the fast multipole boundary element method

✍ Y. J. Liu; L. Shen 📂 Article 📅 2007 🏛 John Wiley and Sons 🌐 English ⚖ 564 KB

## Abstract A dual boundary integral equation (BIE) formulation is presented for the analysis of general 3‐D electrostatic problems, especially those involving thin structures. This dual BIE formulation uses a linear combination of the conventional BIE and hypersingular BIE on the entire boundary o