✦ LIBER ✦
Collapse-free thermal bonding technique for large area microchambers in plastic lab-on-a-chip applications
✍ Scribed by Dong Sung Kim; Hyun Sup Lee; Jungyoup Han; Se Hwan Lee; Chong H. Ahn; Tai Hun Kwon
- Book ID
- 106185314
- Publisher
- Springer-Verlag
- Year
- 2007
- Tongue
- English
- Weight
- 443 KB
- Volume
- 14
- Category
- Article
- ISSN
- 0946-7076
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