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Cohesive zone modeling for structural integrity analysis of IC interconnects

✍ Scribed by B.A.E. van Hal; R.H.J. Peerlings; M.G.D. Geers; O. van der Sluis

Publisher: Elsevier Science
Year: 2007
Tongue: English
Weight: 787 KB
Volume: 47
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2006.08.017

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