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Cobalt electrodeposition on polycrystalline palladium. Influence of temperature on kinetic parameters

โœ Scribed by Mendoza-Huizar, L. H.; Rios-Reyes, C. H.

Book ID
118790158
Publisher
Springer
Year
2012
Tongue
English
Weight
323 KB
Volume
16
Category
Article
ISSN
1432-8488

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Although previous works have shown the marked influence of thiourea as an organic additive in electrolyte bulk on copper electrodeposition, a variety of mechanisms could be responsible. The present paper concerns the effect of a thiourea layer adsorbed prior to copper electrodeposition. First eviden