✦ LIBER ✦
Co-sputtered TiB2 as a diffusion barrier for advanced microelectronics with Cu metallization
✍ Scribed by G. Sade; J. Pelleg
- Publisher
- Elsevier Science
- Year
- 1995
- Tongue
- English
- Weight
- 633 KB
- Volume
- 91
- Category
- Article
- ISSN
- 0169-4332
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