Cleaning of contacts for electronic components

✍ Scribed by L Koller; M Bizjak; K Požun; J Leskovšek; S Vrhovec

• Publisher: Elsevier Science
• Year: 1997
• Tongue: English
• Weight: 329 KB
• Volume: 48
• Category: Article
• ISSN: 0042-207X
• DOI: 10.1016/s0042-207x(97)00044-4

✦ Synopsis

Contact resistance R, of silver alloys AgNiU. 10, AgNiU. 15 andAgCd0 for electronic components, i.e. hermetic relays, depends on mechanical properties and the manufacturing technologies as well as on cleaning processes applied before and after assembling into electronic components. The contact force (F,) measurements of investigated contact materials indicate that the F,_ ,/3 relation is not fulfilled in the range from 3 to 15cN. The results of present investigation indicate that vacuum outgassed contacts have required properties only if the contact force is above 15cN, while for the contacts with F, in the region from 3 to 15cN additional cleaning process of plasma cleaning is suggested. Conventional methods using chemical solvents like fluorocarbons for cleaning of contacts are due to harmful environment influence forbidden in modern society.