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Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers

✍ Scribed by Wang, J.J.; Zhang, Y.P.; Kai Meng Chua, ; Lu, A.C.W.


Book ID
120475559
Publisher
IEEE
Year
2005
Tongue
English
Weight
705 KB
Volume
53
Category
Article
ISSN
0018-926X

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