Residual stresses develop in thermal barrier coating during cool down from processing temperature due to the thermal expansion mismatch between the dierent layers e.g., substrate, bond coat, thermally grown oxide, and TBC. These residual stresses can initiate microcracks at the bond coat/TGO/TBC int
β¦ LIBER β¦
Chronological evaluation of interfacial damage in TBC due to thermal cycling
β Scribed by Z. A. Chaudhury; G. M. Newaz; S. Q. Nusier; T. Ahmed; R. L. Thomas
- Book ID
- 111534914
- Publisher
- Springer
- Year
- 1999
- Tongue
- English
- Weight
- 1013 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0022-2461
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