✦ LIBER ✦
Chip-On-Glass Bonding Using Sn Bump and Non-Conductive Adhesive for LCD Application
✍ Scribed by Kim, Bae-Yong; Chen, Zhigang; Kim, Young-Ho
- Book ID
- 120161650
- Publisher
- Taylor and Francis Group
- Year
- 2006
- Tongue
- English
- Weight
- 541 KB
- Volume
- 458
- Category
- Article
- ISSN
- 1542-1406
No coin nor oath required. For personal study only.