Chip carriers as a means for high-density packaging : Jon S. Prokop and Dale W. Williams. IEEE Trans. Components, Hybrids, mfg Technol.Chmt-1, (3) 297 (September 1978)

• Book ID: 111708945
• Publisher: Elsevier Science
• Year: 1978
• Tongue: English
• Weight: 132 KB
• Volume: 18
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(78)90084-7