Chemo-rheology of curing in structural adhesives. II. Polyimide systems

✍ Scribed by Kaelble, D. H. ;Cirlin, E. H.

• Book ID: 105340780
• Publisher: Wiley (John Wiley & Sons)
• Year: 2007
• Weight: 717 KB
• Volume: 35
• Category: Article
• ISSN: 0449-2994
• DOI: 10.1002/polc.5070350109

✦ Synopsis

Abstract

Polyimide adhesives are cured through the cyclization of the linear main chain of the polymer, rather than through the formation of a network structure. It was found that the average activation energy E* for the imidization process of the curing is 30.5 ± 5.4 kcal/mole and is substantially higher than that of the epoxy‐phenolic adhesive system which we have reported in Part I. The effect of metal filler upon the curing kinetics and mechanical properties of cured material is discussed on the basis of TMA and DSC measurements. In addition, the influence of moisture exposure on the tensile modulus E of the polyimide adhesives are also discussed.