✦ LIBER ✦
ChemInform Abstract: Thermal Stability of Cu/CoSi2 Contacted p+n Shallow Junction with and Without TiW Diffusion Barrier.
✍ Scribed by J.-C. CHIOU; M.-C. CHEN
- Book ID
- 112020699
- Publisher
- John Wiley and Sons
- Year
- 2010
- Weight
- 31 KB
- Volume
- 26
- Category
- Article
- ISSN
- 0931-7597
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