✦ LIBER ✦
ChemInform Abstract: The Crack Opening Method in Silicon Wafer Bonding. How Useful is It?
✍ Scribed by T. MARTINI; J. STEINKIRCHNER; U. GOESELE
- Publisher
- John Wiley and Sons
- Year
- 2010
- Weight
- 27 KB
- Volume
- 28
- Category
- Article
- ISSN
- 0931-7597
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