ChemInform Abstract: Novel Low k Dielectrics Based on Diamondlike Carbon Materials.

✍ Scribed by A. GRILL; V. PATEL; C. JAHNES

• Publisher: John Wiley and Sons
• Year: 2010
• Weight: 29 KB
• Volume: 29
• Category: Article
• ISSN: 0931-7597
• DOI: 10.1002/chin.199830016

✦ Synopsis

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Novel Low k Dielectrics Based on Diamondlike Carbon Materials.

-Hydrogenated diamondlike carbon (DLC) and F containing DLC (FDLC) are investigated for their potential applications as low k dielectrics for the back end of the line interconnect structures in ultralarge scale integrated circuits. The dielectric constant k of DLC can be varied between ¡ 2.7 and ¿ 3.4 by changing the deposition conditions. Only DLC films having dielectric constants k ¿ 3.3 appear to be stable to anneals of 4 h at 400 • C in a nonoxidizing environment. FDLC films, thermally more stable at 400 • C than the DLC films with k ¿ 3.3, can be prepared with dielectric constants below 2.7. -(GRILL, A.;