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ChemInform Abstract: Analysis of Bonding-Related Gas Enclosure in Micromachined Cavities Sealed by Silicon Wafer Bonding.

✍ Scribed by S. MACK; H. BAUMANN; U. GOESELE; H. WERNER; R. SCHLOEGL


Publisher
John Wiley and Sons
Year
2010
Weight
26 KB
Volume
28
Category
Article
ISSN
0931-7597

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