𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Check of semiconductor thermal resistance elements by the method of noise thermometry

✍ Scribed by A. B. Kisilevskii; S. P. Plotnikova; N. A. Sokolov; A. I. Eismont

Publisher
Springer US
Year
1982
Tongue
English
Weight
236 KB
Volume
25
Category
Article
ISSN
0543-1972

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Prediction of bimaterial thermal crackin
Prediction of bimaterial thermal cracking by the boundary element method
✍ Zarnavelis, J. K. ;Katsareas, D. E. ;Antifantis, N. K. πŸ“‚ Article πŸ“… 1998 πŸ› John Wiley and Sons 🌐 English βš– 146 KB πŸ‘ 1 views

A boundary element procedure is developed concerning the prediction of the quasistatic crack growth in uniformly heated bimaterials. This procedure assumes the existence of an initial small crack in one of the two phases, and further cracking progress from this point due to thermal loading. The resu