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Charge Redistribution at GaN–Ga2O3 Interfaces: A Microscopic Mechanism for Low Defect Density Interfaces in Remote Plasma Processed MOS Devices Prepared on Polar GaN Faces

✍ Scribed by Therrien, R. ;Lucovsky, G. ;Davis, R. F.


Publisher
John Wiley and Sons
Year
1999
Tongue
English
Weight
143 KB
Volume
176
Category
Article
ISSN
0031-8965

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