✦ LIBER ✦
Characterization technique in phase distribution during sample preparation for applications to solder joints and wire-bonding chips
✍ Scribed by Hung-Kai Chen; Shih-Hai Li; Jenq-Gong Duh
- Book ID
- 110627020
- Publisher
- Springer US
- Year
- 2006
- Tongue
- English
- Weight
- 593 KB
- Volume
- 35
- Category
- Article
- ISSN
- 0361-5235
No coin nor oath required. For personal study only.