𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Characterization of semiconductor interfaces using a modified mixed mode bending apparatus

✍ Scribed by J. Thijsse; O. van der Sluis; J.A.W. van Dommelen; W.D. van Driel; M.G.D. Geers

Book ID
108210718
Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
287 KB
Volume
48
Category
Article
ISSN
0026-2714

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

On the analysis of a mixed mode bending
On the analysis of a mixed mode bending sandwich specimen for debond fracture characterization
✍ A. Quispitupa; C. Berggreen; L.A. Carlsson πŸ“‚ Article πŸ“… 2009 πŸ› Elsevier Science 🌐 English βš– 905 KB

The mixed mode bending specimen originally developed for mixed mode delamination fracture characterization of unidirectional composites has been extended to the study of debond propagation in foam cored sandwich specimens. The compliance and strain energy release rate expressions for the mixed mode