Characterization of barrier/seed layer stacks of Cu interconnects by electron tomographic three-dimensional object reconstruction

✍ Scribed by Heiko Stegmann; Hans-Jürgen Engelmann; Ehrenfried Zschech

• Book ID: 108411247
• Publisher: Elsevier Science
• Year: 2003
• Tongue: English
• Weight: 637 KB
• Volume: 65
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/s0167-9317(02)00849-3