Characterization of a fracture specimen for crack growth in epoxy due to thermal fatigue
β Scribed by T. Tang; C.Y. Hui; H.G. Retsos; E.J. Kramer
- Publisher
- Elsevier Science
- Year
- 2005
- Tongue
- English
- Weight
- 420 KB
- Volume
- 72
- Category
- Article
- ISSN
- 0013-7944
No coin nor oath required. For personal study only.
β¦ Synopsis
Finite element simulations are carried out to characterize a new fracture specimen, consisting of an outer circular epoxy ring bonded to an inner circular invar plate for accelerated thermal fatigue testing. Radial cracks are introduced in the epoxy ring. The growth of these radial cracks is correlated to the applied energy release rate G. We studied the dependence of G on the crack length, the specimen geometry and the elastic modulus. For short cracks, G is obtained in closed form. Analysis is carried out to determine the critical thermal buckling load the specimen can withstand. Experimental results show that the fatigue crack growth rate per thermal cycle da/dN is given by da/dN = 0.51(DG) 0.38 for cycling between 4 and 100 Β°C but by da/dN = 0.25(DG) 0.24 for cycling between 20 and 85 Β°C, where DG is the difference of the energy release rate between the highest and lowest temperatures during a thermal cycle. More severe thermal cycles produce considerably larger fatigue crack growth rates than less severe ones at the same DG. This result also implies that isothermal fatigue tests will probably be inadequate to predict thermal fatigue crack growth in epoxies.
π SIMILAR VOLUMES
numerical simulation of the stable crack growth in a thick smooth compact tension specimen with two-dimensional elastic-plastic finite element analyses is presented. The different fracture behaviors in the center and near the side surfaces of the specimen were accounted for by using plane strain ana
For the lifetime prediction of pressurized polyethylene (PE) pipes based on methods of the linear elastic fracture mechanics the knowledge of the crack resistance and the kinetics of creep crack growth (CCG) is essential. In the present work a rather brittle nonpipe material was used to develop a me
Residual stresses develop in thermal barrier coating during cool down from processing temperature due to the thermal expansion mismatch between the dierent layers e.g., substrate, bond coat, thermally grown oxide, and TBC. These residual stresses can initiate microcracks at the bond coat/TGO/TBC int