Characterization and comparison of single and stacked MIMC in copper interconnect Process for mixed-mode and RF applications

✍ Scribed by Ng, C.H.; Ho, C.S.; Toledo, N.G.; Chu, S.-F.

• Book ID: 111882254
• Publisher: IEEE
• Year: 2004
• Tongue: English
• Weight: 253 KB
• Volume: 25
• Category: Article
• ISSN: 0741-3106
• DOI: 10.1109/led.2004.830283