Characterisation of the electroless nickel deposit as a barrier layer/under bump metallurgy on IC metallisation

✍ Scribed by James F Rohan; Gerald O’Riordan

• Publisher: Elsevier Science
• Year: 2003
• Tongue: English
• Weight: 554 KB
• Volume: 65
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/s0167-9317(02)00730-x