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Change in Internal Friction and Elastic Modulus during Recrystallization of High Purity Copper

✍ Scribed by Lee, C. G. ;Okuda, S.

Publisher: John Wiley and Sons
Year: 1997
Tongue: English
Weight: 216 KB
Volume: 164
Category: Article
ISSN: 0031-8965
DOI: 10.1002/1521-396x(199712)164:2<659::aid-pssa659>3.0.co;2-w

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