Ceramic Integration and Joining Technologies: From Macro to Nanoscale

✍ Scribed by Singh, Mrityunjay;Ohji, Tatsuki;Asth, Rajiv

• Publisher: Wiley-American Ceramic Society
• Year: 2011
• Tongue: English
• Leaves: 827
• Category: Library

✦ Synopsis

"This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage. This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators"--

✦ Table of Contents

1. Ceramic Integration Across Length Scales: Technical Issues, Challenges, And Opportunities --
   2. Ceramic Component Integration By Advanced Brazing Technologies / Tatsuki Ohji / Mrityunjay Singh / Rajiv Asthana / Sanjay Mathur --
   3. Joining And Integration Issues Of Ceramic Matrix Composites For The Nuclear Industry / Jolanta Janczak-Rusch --
   4. Air Brazing: A New Method Of Ceramic-Ceramic And Ceramic-Metal Joining / Monica Ferraris / Milena Salvo / Valentina Casalegno --
   5. Diffusion Bonding Of Silicon Carbide As An Enabling Technology For The Fabrication Of Complex-Shaped Ceramic Components / J.T. Darsell / K.S. Weil / J.Y. Kim --
   6. Integration Of Carbon-Carbon Composite To Metallic Systems For Thermal Management Applications / Mrityunjay Singh / Michael C. Halbig --
   7. Contact Interaction In Carbon-metal Systems For Joining And Integration / Rajiv Asthana / Mrityunjay Singh --
   8. Integration Technologies For Ferrites And Power Inductors In Ceramic Circuit Boards / V.M. Perevertailo / O.B. Loginova --
   9. Oxide Thermoelectric Power Generation / Richard Matz --
   10. Integration Technologies For Solid Oxide Fuel Cells (Sofcs) And Other Electrochemical Reactors / Delphine Flahaut / Ryoji Funahashi / Saori Urata / Atsuko Kosuga --
   11. Integration Technologies For Sensors / Masanobu Awano / Nigel Sammes / Koichi Hamamoto / Toshiro Yamaguchi / Toshio Suzuki / Yoshinobu Fujishiro --
   12. On-Chip Integration Of Functional Hybrid Materials And Components In Nanophotonics And Optoelectronics / Maiko Nishibori / Woosuck Shin / Ichiro Matsubara --
   13. Integration Of Multifunctional Properties In Thermal Barrier Coatings By Chemical Vapor Deposition / Hilmi Volkan Demir / Talha Erdem --
   14. The Changing Physics In Metal Interconnect Reliability / Takashi Goto --
   15. Integration Issues Of Barium Strontium Titanate Thin Film For Tunable Microwave Applications / Yuejin Hou / Cher Ming Tan --
   16. Aerosol Deposition (Ad) Integration Techniques And Their Application To Microdevices / Ashok Kumar / Supriya Ketkar / Venkataraman Gurumurthy --
   17. Advances In Nanointegration Methodologies: Patterning, Positioning, And Self-Assembly / Jun Akedo --
   18. Integration Of Nanowires In New Devices And Circuit Architectures: Recent Developments And Challenges / Yoshitake Masuda / Kunihito Koumoto --
   19. Integrating Diamond-Like Carbon Into Nanostructure Designs (Fabricating Microscale And Nanoscale Architectures Of Diamond-Like Carbon Films) / F. Hernández-Ramirez / J.D. Prades / A. Romano-Rodriguez / S. Barth / H. Shen / S. Mathur --
   20. Synthesis, Properties, Integration, And Applications Of Vertically Aligned Ceramic Nanostructures / Daniel H.C. Chua / Xijun Li --
   21. Nanointegration Based On Thin-Film Technology / D. Pliszka / S. Ramakrishna / S. Sundarrajan --
   22. Mass-Manufacturable Nanowire Integration: Challenges And Recent Developments / R. Aggarwal / C. Jin / W. Wei / R.J. Narayan --
   23. Usability Of Ink-Jet Printing Technology And Nanomaterials In Electrical Interconnections, Electronic Packaging, And System Integration For Microelectronics Applications / M. Saif Islam / Ataur Sarkar --
   24. Biointegration Of Prosthetic Devices / Pauliina Mansikkamäki / Jussi Pekkanen / Jani Valkama / Umur Caglar / Ville Pekkanen.

✦ Subjects

TECHNOLOGY & ENGINEERING--Material Science;Manufacturing processes;Ceramic materials;Joints (Engineering);TECHNOLOGY & ENGINEERING -- Material Science