Cell surface-engineered yeast with ability to bind, and self-aggregate in response to, copper ion

✍ Scribed by K. Kuroda; M. Ueda; S. Shibasaki; A. Tanaka

• Book ID: 105949136
• Publisher: Springer
• Year: 2002
• Tongue: English
• Weight: 137 KB
• Volume: 59
• Category: Article
• ISSN: 1432-0614
• DOI: 10.1007/s00253-002-1014-8