solution with bubbling formaldehyde and copper is reduced The adsorption of a cationic polyacrylamide (acrylamide/bby exposed Pd catalyst (1-5). The key requirement of the methacryloxyethyltrimethylammonium methyl sulfate copolymer) process is to achieve the ''appropriate'' catalyst loading. onto an imidazole catalyzed bisphenol-A based epoxy resin surface Insufficient catalyst loading will result in voids in the copper was examined by surface wetting. The work of adhesion of diododeposit, creating open circuits. At the other extreme, too methane, ethylene glycol and water was measured on microscopimuch catalyst can cause adhesive failure between the phocally smooth epoxy surfaces using a Wilhemy plate method, in toresist and the underlying substrate, which permits the platboth advancing and receding modes. The cationic polyacrylamide ing solution to leak beneath the photoresist and deposit copwas adsorbed from aqueous solutions as a function of the pH of the solution. In addition to the cationic quaternary amine groups per between the circuit lines forming short circuits.
along the polymer chain, there were carboxylate groups from am-Deposition of the Pd/Sn catalyst depends critically on the ide hydrolysis, which had a pK a of 10.73. The surface wetting adsorbed polyelectrolyte. The Pd/Sn colloidal particles do of neither diodomethane nor ethylene glycol was sensitive to the not appreciably adsorb on the epoxy surface. The cationic adsorbed polyacrylamide. Wetting of the surface by water was polyelectrolyte is adsorbed onto the epoxy laminate from very sensitive to the presence of adsorbed polyacrylamide. Polysolution, forming a thin film on the epoxy surface. The acrylamides in solutions below pH 9 adsorbed onto the epoxy coated surface is then exposed to a solution containing negasurface resulting in increased water adhesion to the surface. When tively charged Pd/Sn colloidal particles which are attracted the polyacrylamide solution was greater than pH 9 carboxylate to the cationic groups of the adsorbed polyelectrolyte. groups ionized and the anions inhibited adsorption of the polyacrylamide. The water wetting measurements were shown to corre-Processing conditions, such as etching the laminate surlate with the adsorption of Pd/Sn colloidal particles used for elecface with permanganate solutions and changing the pH of troless deposition of copper circuit lines on printed circuit boards. the polyelectrolyte solutions resulted in variations in the Pd/