Case study: the design of a mixed-signal global positioning system receiver using multichip module packaging : Patrick J. Zabinski et al. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 215 (1996)

• Book ID: 108362311
• Publisher: Elsevier Science
• Year: 1997
• Tongue: English
• Weight: 144 KB
• Volume: 37
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/s0026-2714(97)87734-7