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Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders

✍ Scribed by Hiroshi Ogura; Minoru Maruyama; Ryo Matsubayashi; Tetsuya Ogawa; Shigeyoshi Nakamura; Teruo Komatsu; Hiroshi Nagasawa; Akio Ichimura; Seiji Isoda


Book ID
107456923
Publisher
Springer US
Year
2010
Tongue
English
Weight
710 KB
Volume
39
Category
Article
ISSN
0361-5235

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