Carbon black dispersions as thermal pastes that surpass solder in providing high thermal contact conductance

✍ Scribed by Chia-Ken Leong; D.D.L. Chung

• Book ID: 104106660
• Publisher: Elsevier Science
• Year: 2003
• Tongue: English
• Weight: 271 KB
• Volume: 41
• Category: Article
• ISSN: 0008-6223
• DOI: 10.1016/s0008-6223(03)00247-1