C-4/CBGA comparison with other MLC single chip package alternates : KARL J. PUTTLITZ and WILLIAM F. SHUTLER. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(2), 250 (May 1995)

• Publisher: Elsevier Science
• Year: 1996
• Tongue: English
• Weight: 119 KB
• Volume: 36
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(96)84486-6